Lightweight structures having increased structural integrity and an ultra-low coefficient of thermal expansion
US11712844B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2020 |
| Grant date | Aug 1, 2023 |
| Priority date | — |
| Expiry date | Mar 13, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/9607
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is directed toward an additive manufacturing method for manufacturing silica-based structures that have a low linear cure shrinkage percentage and an ultra-low coefficient of thermal expansion. The structure may be constructed with a powder mixture that contains at least a first set of silica-based particles that are spherical and that have a first size, and a second set of submicron silica-based particles that are jagged, spherical, or both jagged and spherical. The silica-based powder mixture may be combined with a surfactant in order to create a slurry that can be used to create a 3D printed structure that has a low linear cure shrinkage percentage and an ultra-low coefficient of thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.