MEMS chip structure
US11713239B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Jun 29, 2020 |
| Grant date | Aug 1, 2023 |
| Priority date | — |
| Expiry date | Jul 18, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0866
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.