Patent · US Active

Vacuum systems for epoxy mounting of material samples

US11714032B2 · kind B2 · utility

0Cited by
2References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 22, 2019
Grant dateAug 1, 2023
Priority date
Expiry dateSep 23, 2041

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N2001/364
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Vacuum systems for epoxy mounting of material samples are disclosed. In some examples, a vacuum system may be a castable and/or cold mounting vacuum system that facilitates mounting and/or encapsulation of material samples in epoxy resin under low, vacuum, and/or near vacuum pressure. In some examples, the vacuum system may comprise a flow control device configured to control epoxy flow through a dispensing tube that connects to a hollow vacuum chamber. In some examples, the vacuum chamber may have an opening encircled by a rim sandwiched between upper and lower portions of a sealing ring. A movable lid may be configured to press down on the upper portion of the sealing ring when in a closed position, so as to seal the opening.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.