Electronic device having thermal diffusion structure
US11714468B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2021 |
| Grant date | Aug 1, 2023 |
| Priority date | — |
| Expiry date | Dec 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/42
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.