Method of producing a multi-layer ceramic electronic component, multi-layer ceramic electronic component, and circuit board
US11715604B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 11, 2021 |
| Grant date | Aug 1, 2023 |
| Priority date | — |
| Expiry date | Jul 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of producing a multi-layer ceramic electronic component includes: forming a base film formed from an electrically conductive material on a surface of a ceramic body including internal electrodes laminated and drawn to the surface in such a manner that the base film is connected to the internal electrodes; forming a first nickel film on the base film by an electrolytic plating method; performing, after forming the first nickel film, heat treatment in a weakly reducing atmosphere at a temperature equal to or higher than a temperature at which the first nickel film is recrystallized; and forming a second nickel film on the first nickel film, on which the heat treatment is performed, by an electrolytic plating method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.