Millimeter-wave active antenna unit, and interconnection structure between PCB boards
US11716812B2 · kind B2 · utility
0Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2019 |
| Grant date | Aug 1, 2023 |
| Priority date | — |
| Expiry date | Dec 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09727
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A millimeter-wave active antenna unit and an interconnection structure between PCBs is provided. The interconnection structure between PCBs comprises a mainboard and an AIP antenna module. The mainboard is a first multilayer PCB on which a signal transmission line and a first pad electrically connected to the signal transmission line are provided. The AIP antenna module is a second multilayer PCB on which a second pad, an impedance matching transformation branch, an impedance line and a signal processing circuit are provided. The mainboard and the AIP antenna module are interconnected by directly welding multiple PCBs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.