System and method for cutting a metallic film
US11717979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2020 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | Feb 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01M2004/027
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for cutting a metallic film is disclosed. The method includes: feeding the metallic film between a scoring blade and an anvil at a first speed; feeding a first protective film between the metallic film and the scoring blade; feeding a second protective film between the metallic film and the anvil; moving the scoring blade toward the anvil for applying a pressure onto the first protective film, the metallic film, and the second protective film disposed between the scoring blade and the anvil for making a score along a width of the protective film; and pulling the metallic film having passed between the scoring blade and the anvil at a second speed. The second speed being greater than the first speed. A difference between the first and second speeds causes the metallic film to cut at the score. A system for cutting a metallic film is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.