Molds having cooling behind insert technology and related methods
US11718004B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2019 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | May 31, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/0016
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This disclosure includes injection molds for reducing cycle times and related methods. Some molds include first and second mold portions movable relative to one another from an open position to a closed position in which each of one or more recesses of the first mold portion cooperates with a respective one of one or more recesses of the second mold portion to define a chamber. Each of the chamber(s) includes a first cooling body coupled to the first mold portion, a second cooling body coupled to the second mold portion, and first and second inserts removably coupled, respectively, to the first and second cooling bodies such that the inserts cooperate to define a mold cavity within the chamber that is configured to receive a thermoplastic material. Each of the cooling bodies has an inlet, an outlet, and a fluid cavity in fluid communication with the inlet and the outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.