Resin composition and article made therefrom
US11718752B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2021 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | Jan 21, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2453/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.