Material processing utilizing high-frequency beam shaping
US11719897B2 · kind B2 · utility
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17References
57Claims
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Key dates
| Filing date | Mar 27, 2020 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | Apr 7, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.