Methods for co-packaging optical modules on switch package substrate

US11719898B2 · kind B2 · utility

Assignee

• MARVELL ASIA PTE LTD · SG

Inventors

• Radhakrishnan L. Nagarajan · Santa Clara, US
• Mark Patterson · San Diego, US

Key dates

• Filing date: Mar 3, 2021
• Grant date: Aug 8, 2023
• Expiry date: May 31, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4261
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An assembled electro-optical switch module includes a package substrate. Four optical socket members are disposed respectively to the package substrate. Each optical socket member includes four sockets closely packed in a row. Each socket has a recessed flat region with topside land grid array (LGA) interposer connected to bottom side solder bumps and a side notch opening aligned to an edge of the package substrate at the corresponding edge region. Sixteen optical modules in four sets are co-packaged in the package substrate. Each set has four optical modules respectively seated in the four sockets of each optical socket member with top side LGA interposer. Four clamp latch members are applied to clamp each of the four sets of optical modules in respective optical socket members. A data processor device with 51.2 Tbps data interface is disposed to the package substrate and electrically coupled to each of the sixteen optical modules.