Coil electronic component
US11721474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2019 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | Jun 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2809
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.