Self-aligned contact
US11721728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2020 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | Nov 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6219
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to self-aligned contacts and methods of manufacture. The structure includes: adjacent diffusion regions located within a substrate material; sidewall structures above an upper surface of the substrate material, aligned on sides of the adjacent diffusion regions; and a contact between the sidewall structures and extending to within the substrate material between and in electrical contact with the adjacent diffusion regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.