Front-end modules with ground plane slots
US11721899B2 · kind B2 · utility
0Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2022 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | May 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.