Nozzle and applicator system comprising the same
US11724266B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2018 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Feb 15, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/1028
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An applicator system for applying a material to a substrate is disclosed, the applicator system having a nozzle assembly (28) that includes a nozzle having a nozzle head (108). The nozzle assembly (28) also includes a baffle plate (101) including a cutout (144) that extends through the baffle plate (101), where the baffle plate (101) is received by the nozzle head (108) such that the nozzle head (108) and the baffle plate (101) define a cavity. The nozzle assembly (28) further includes a cover plate (102) attached to the nozzle head (108) such that the cover plate (102) secures the baffle plate (101) within the nozzle head (128), where an outlet passage is defined between the baffle plate (101) and the cover plate (102), the outlet passage being fluidly connected to the cavity through the cutout (144) of the baffle plate (101).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.