Method and device for liquid spray soldering and the application method thereof
US11724326B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Sep 1, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/72
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The disclosure relates to the field of spray welding, and involves a method and a device for liquid spray welding, as well as the application method thereof. The method for liquid spray welding specifically comprises the following steps: S1: Solder to be spray-soldered is melted under the protection of an inert gas; S2: Then, the melted solder is spray-soldered while using ultrasonic focusing. The device includes a solder conversion mechanism which consists of a container; the cavity in the container is used for placing the solder; a spraying hole is arranged at the bottom of the container to connect with the cavity, and a heating mechanism is mounted along the outer wall of the container; a device for driving the solder spraying is used to control the frequency of an ultrasonic generating mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.