Polyimide compositions and articles incorporating the same
US11725079B2 · kind B2 · utility
0Cited by
9References
19Claims
0Family size
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Key dates
| Filing date | Jul 15, 2021 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Compositions including a polyimide and one or more thermally conductive fillers, and compaction rollers for an automated fiber placement machine incorporating the compositions are provided. The polyimide may be a polymeric reaction product of a dianhydride and one or more diamines. The one or more diamines may include a fluorine-containing alkyl ether diamine. The one or more thermally conductive fillers may include one or more of a carbon-based filler, boron nitride, a metal, or combinations thereof. The compositions may have a thermal conductivity of from about 0.2 to about 50 Watts per meter Kelvin (Wm−1 K−1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.