Impregnation sealant for electronic components
US11725128B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2020 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jun 17, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0625
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an anaerobically curable impregnation sealant composition and methods thereof containing a (meth)acrylic monofunctional monomer with a hydrophobic moiety, a (meth)acrylic monofunctional monomer with a hydroxyl group, a modified polyester urethane methacrylate resin having a weight average molecular weight of from about 8000 to about 18000 g/mol, and triallylisocyanurate, triallylcyanurate, or derivatives thereof, or a combination thereof. The present invention particularly relates to a sealant composition for impregnation to plastic and metal substrates that also provides resistance to thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.