Electronic device and manufacturing method thereof
US11725273B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2021 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Dec 27, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electronic device and a manufacturing method thereof are provided. The electronic device includes an array substrate, which includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer. The substrate has a substrate surface. The first conductive layer is located on the substrate surface. The first insulating layer is located on the first conductive layer. The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer. The second insulating layer is located on the second conductive layer. The second sputtering layer is located between the first and third sputtering layers, and includes a first metal element. The first sputtering layer includes the first metal element and a second metal element. The third sputtering layer includes the first metal element and a third metal element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.