Methods for partial gold plating of metal packaging housings and packaging housings thereof
US11725294B2 · kind B2 · utility
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15Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 21, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Oct 21, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D13/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure involves a method for partial gold plating of a metal packaging housing and a packaging housing thereof. The packaging housing may include a base. The base may be provided with at least one lead hole. A housing lead may be interspersed in the lead hole. The lead hole may be also provided with an insulator surrounding the housing lead. The method may include operations such as nickel plating, oxidation, gold plating, reduction, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.