Hemispherical bushing assembly
US11725691B2 · kind B2 · utility
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3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2021 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Sep 27, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB62D3/12
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A bushing assembly includes a bushing housing having an inner surface that is non-planar. The bushing assembly also includes an insert member having an interface surface in contact with the inner surface of the bushing housing, wherein the interface surface comprises a non-planar geometry corresponding to the inner surface of the bushing housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.