Heat pump
US11725857B1 · kind B1 · utility
1Cited by
0References
8Claims
0Family size
Inventors
Key dates
| Filing date | Jan 31, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jan 31, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2500/31
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system for a heat pump that allows the heat pump to work efficiently in extreme cold weathers. The system includes an evaporator influid communication with an expansion valve, the expansion valve can receive a liquid refrigerant from a condenser of the heat pump. The evaporator contains a pool of liquid refrigerant and an electric resistance heating source dipped in the pool of liquid refrigerant. The electric resistance heating source can heat the liquid refrigerant of the pool to generate vapors and thus maintaining a desired pressure within the heat pump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.