Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate
US11725995B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jan 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.