Electrostatic chuck and wafer etching device including the same
US11728198B2 · kind B2 · utility
0Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2019 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Feb 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck according to an embodiment includes a fixing plate on which a wafer is fixed, an electrostatic plate located under the fixing plate and configured to generate an electrostatic force to fix the wafer on the fixing plate, a plurality of heating elements located under the electrostatic plate and separated to locally control a temperature of the electrostatic plate, and a cooling plate located under the plurality of separated heating elements and configured to emit heat transferred by the plurality of separated heating elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.