Patent · US Active

Optoelectronic component and manufacturing method

US11728321B2 · kind B2 · utility

0Cited by

2References

4Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Daniel Richter · Bad Abbach, DE
Tobias Gebuhr · Regensburg, DE
Michael Betz · Huxley, US
Markus Boss · Regensburg, DE

Key dates

Filing date	Feb 25, 2019
Grant date	Aug 15, 2023
Priority date	—
Expiry date	Feb 25, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/851
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.