Light emitting element, manufacturing method thereof, and composition including the same
US11728464B2 · kind B2 · utility
1Cited by
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15Claims
0Family size
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Key dates
| Filing date | Jul 21, 2020 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Apr 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A light emitting element includes a first semiconductor layer; an active layer on the first semiconductor layer; a second semiconductor layer on the active layer; an insulating film surrounding an outer peripheral surface of each of the first semiconductor layer, the active layer and the second semiconductor layer; and a polymer film including a polymer chain and on at least a portion of a surface of the insulating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.