Low-field assembled isolator
US11728554B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | May 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/387
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a low-field assembled isolator, which includes a rectangular body, wherein the body includes an upper cavity and a lower cavity which are connected in a stacked manner; gaps are formed in four side surfaces of the body through the joint surfaces of the upper cavity and the lower cavity respectively; and the isolator further includes a U-shaped magnetic circuit cover plate and two L-shaped magnetic circuit baffles; and the two L-shaped magnetic circuit baffles are respectively disposed at two corners, away from the vertical plate, of the body so as to seal the joint between two adjacent gaps. The gaps at the joint of the upper cavity and the lower cavity are effectively and fully sealed, thereby effectively preventing signal leakage and improving the performance of the low-field assembled isolator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.