Grounding plate and methods of shipping and installing a grounding plate
US11728579B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Apr 1, 2020 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Aug 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02G13/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of transporting grounding plates is provided, having a step of providing a plurality of grounding plates made from an electrically conductive material. Each grounding plate has a plate body with first and second faces that are planar, opposed, and parallel to each other, and a grounding connector formed from the same material and having a first end connected to the plate body. The grounding connector is bendable about the first end from a planar configuration to a functional configuration. In the planar configuration, the grounding connector is aligned with and parallel to the first and second faces of the plate body, and in the functional configuration, the grounding connector is at an angle relative to the first face of the plate body. The method has the further steps of stacking the plurality of grounding plates in the planar configuration and transporting the stack to a destination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.