Patent · US Active

Method and apparatus to use active semiconductor interposers for RF signal chain in modular stacked integrated circuits

US11728909B2 · kind B2 · utility

0Cited by

13References

20Claims

0Family size

Assignee

Shenzhen Chipuller Chip Technology Co., LTD · CN

Inventors

Jawad Nasrullah · Stanford, US
Omar Alnaggar · Palo Alto, US
Hanfeng Wang · San Jose, US
Mohamed Sameh Mahmoud · Sunnyvale, US

Key dates

Filing date	Apr 12, 2022
Grant date	Aug 15, 2023
Priority date	—
Expiry date	Apr 12, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH04B17/13
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.