Electromagnetic shielding structure for an overmolded printed circuit board
US11729897B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jun 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed hybrid shielding structure may include a printed circuit board (PCB) that is to be overmolded with at least a portion of molding compound. The PCB may include various electronic components disposed thereon. The hybrid shielding structure may also include conductive trenches and conductive fences that are disposed on the PCB. The conductive trenches and the conductive fences may provide an electromagnetic shield for at least a portion of the electronic components of the PCB. The hybrid shielding structure may further include a conformal shielding and a PCB ground flood and ground layers. Various other systems, electronic devices, apparatuses, and methods of manufacturing are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.