Method of producing untethered, stretchable, and wearable electronic devices

US11729904B2 · kind B2 · utility

Assignee

• CARNEGIE MELLON UNIVERSITY · US

Inventors

• Eric Markvicka · Brush, US
• Michael D. Bartlett · Ames, US
• Carmel Majidi · Berkeley, US
• Lining Yao · Cambridge, US
• Guanyun Wang · Hangzhou City, CN
• Yi-Chin Lee · Pittsburgh, US
• Gierad Laput · Pittsburgh, US

Key dates

• Filing date: May 4, 2020
• Grant date: Aug 15, 2023
• Expiry date: Jun 13, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/167
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

An efficient fabrication technique, including an optional design step, is used to create highly customizable wearable electronics. The method of fabrication utilizes rapid laser machining and adhesion-controlled soft materials. The method produces well-aligned, multi-layered materials created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. The design step can be used to create a 3D device that conforms to different-shaped body parts. These techniques are applied using commercially available materials. These methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.