Active device with heat sink and low mechanical stress
US11729945B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Oct 24, 2019 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jul 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An active device with a heat sink and low mechanical stress comprises a heat-producing substrate having a first thermal expansion coefficient; a heat sink having a second thermal expansion coefficient, wherein the first and second thermal expansion coefficients are different; and an interface between the heat-producing substrate and the heat sink formed so that, when the heat-producing substrate is operating at a predetermined temperature, a mechanical stress between the heat-producing substrate and the heat sink is substantially minimized. The heat sink has a yield strength that is lower than a yield strength of the heat-producing substrate and has been plastically deformed during fabrication to minimize the stress between the heat-producing substrate and the heat sink. Methods for fabricating the device are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.