Immersion cooling system with dual dielectric cooling liquid circulation
US11729950B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Mar 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/208
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.