Cooling device with processing head of a lamination molding apparatus
US11731200B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2020 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Aug 6, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The lamination molding apparatus includes an irradiator, a processing device, a cooling device, and an inert gas supply source. The irradiator irradiates a laser beam or an electron beam to a material layer to form a solidified layer. The processing device includes a processing head for holding a tool, and a processing head driver for moving the processing head in at least a horizontal direction. The cooling device is arranged in the processing head and cools a solidified body formed by laminating the solidified layers to a cooling temperature. The cooling device includes a cold gas discharger having a cold gas discharge port for discharging a cold gas being an inert gas having a temperature equal to or lower than the cooling temperature, and discharging the cold gas toward the solidified body. The inert gas supply source supplies the inert gas to the cold gas discharger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.