Patent · US Active

Manifold and related methods for use with a reservoir for additive manufacturing

US11731359B2 · kind B2 · utility

0Cited by
0References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 14, 2022
Grant dateAug 22, 2023
Priority date
Expiry dateOct 14, 2042

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB33Y40/10
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

The presently disclosed embodiments generally relate to reservoir manifold systems suitable for use with an additive manufacturing apparatus. Such manifold systems enable ease of use for making mechanical, electrical, and fluid connections to a reservoir used for additive manufacturing. Conduits formed in the reservoir manifold can allow for a fluid connection to be established with a reservoir to allow fluid flow into and out of the reservoir. The reservoir manifold can include one or more arms that are configured to move independently to couple to the reservoir of the printing apparatus. The reservoir manifold can include a trigger coupled to a latch mechanism for engaging one or more components of the apparatus. In some embodiments, the ability of the manifold to make electrical connections to the reservoir may present advantages to the ease-of-use and reliability of an additive manufacturing apparatus.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.