Polishing compositions and methods of use thereof

US11732157B2 · kind B2 · utility

Assignee

• Fujifilm Electronic Materials U.S.A., Inc. · US

Inventors

• Yannan Liang · Gilbert, US
• Bin Hu · Mesa, US
• Liqing Wen · Mesa, US
• Shu-Wei Chang · Hsinchu, TW

Key dates

• Filing date: Oct 6, 2020
• Grant date: Aug 22, 2023
• Expiry date: Oct 6, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A polishing composition includes an abrasive; an optional pH adjuster; a barrier film removal rate enhancer; a TEOS removal rate inhibitor; a cobalt removal rate enhancer; an azole-containing corrosion inhibitor; and a cobalt corrosion inhibitor.