Masking film for protecting sensitive substrates
US11732161B2 · kind B2 · utility
0Cited by
9References
11Claims
0Family size
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Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Jun 5, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2453/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 μm and 150 μm. The masking film also includes a release layer on a side of the adhesion layer opposite the outer adhesion surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.