Methods of forming cutting elements
US11732532B2 · kind B2 · utility
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6References
4Claims
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Assignee
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Key dates
| Filing date | Feb 13, 2020 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Sep 5, 2041 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/567
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A cutting element comprises a supporting substrate, a cutting table comprising a hard material attached to the supporting substrate, and a fluid flow pathway extending through the supporting substrate and the cutting table. The fluid flow pathway is configured to direct fluid delivered to an outermost boundary of the supporting substrate through internal regions of the supporting substrate and the cutting table. A method of forming a cutting element and an earth-boring tool are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.