Thermal management systems
US11732941B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2021 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Jan 30, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2600/2519
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal management system includes an integrated open-circuit refrigeration system and closed-circuit heat pump system. The thermal management system includes a receiver having a first receiver port and a second receiver port, the receiver configured to store a refrigerant fluid, an evaporator having a first evaporator port and a second evaporator port, the heat pump circuit having a closed-circuit fluid path with the receiver and the evaporator and an open-circuit refrigeration system configured to receive refrigerant from the receiver, with the open-circuit refrigeration system having an open-circuit fluid path that includes the receiver and the evaporator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.