Chip crack detection apparatus
US11733289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Feb 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/647
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip crack detection apparatus includes a function circuit and a die crack detection module surrounding the function circuit. The die crack detection module includes a front-end-of-line device layer, a laminated structure on the front-end-of-line device layer that includes a conducting wire in the laminated structure, a detection interface, and a capacitor at the front-end-of-line device layer. A first end of the conducting wire is configured to connect to a positive electrode of a power supply. A second end of the conducting wire is configured to connect to a negative electrode of the power supply. The capacitor is connected in parallel between the first end and the second end of the conducting wire. The detection interface is coupled with the conducting wire between the first end and the second end of the conducting wire. The detection interface is configured to detect whether a die crack occurs in the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.