Sensor package

US11733318B2 · kind B2 · utility

Assignee

• MELEXIS TECHNOLOGIES SA · CH

Inventors

• Vincent Hiligsmann · Bevaix, CH
• Wolfram Kluge · Dresden, DE
• David Ihle · Bevaix, CH
• Jian-Ru Chen · Baoshan, TW
• Jorg Rudiger · Bevaix, CH
• Sascha Beyer · Medingen, DE

Key dates

• Filing date: Jan 22, 2019
• Grant date: Aug 22, 2023
• Expiry date: Feb 19, 2039

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R33/04
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A sensor package comprises a non-conductive substrate, at least two electrically conductive coils located at a first side of the non-conductive substrate, an evaluation circuit located at a second side of the non-conductive substrate opposing the first side of the non-conductive substrate and conductive connections between the at least two electrically conductive coils and the evaluation circuit.