Surface inspection method using mold surface inspection device
US11733685B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Jul 28, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure relates to a surface inspection method using a mold surface inspection device, and more specifically, to a surface inspection method using a mold surface inspection device including a setting part in which an inspection object is set, a light source part configured to irradiate the inspection object with irradiated light so that a reflective highlight is generated on a surface of the inspection object, an imaging part configured to image the surface of the inspection object so that a highlight region where a reflective highlight is generated is included, and an image processing part configured to process an image imaged in the imaging part to provide the image to a worker so that the worker determines whether defects are generated on the surface of the inspection object on the basis of the image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.