Conductive laminated structure and foldable electronic device
US11733731B2 · kind B2 · utility
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3References
20Claims
0Family size
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Key dates
| Filing date | Aug 3, 2020 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Oct 27, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive laminated structure includes a conductive layer and a thickening layer. The conductive layer extends in a first direction. The thickening layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakage when a radius of curvature R is equal to 3 mm, a folding direction is perpendicular or parallel to the first direction, and a folding angle is 180°. A foldable electronic device is also provided herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.