Parametric modelling and grading
US11733853B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 28, 2022 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Sep 28, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2200/24
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In some implementations, a method for custom fitting and manufacturing parametric products comprises generating a plurality of parametric 3D models of a custom product based on past learned data pertaining to the custom product; generating a first user interface comprising at least a first graphical representation of the custom product; receiving a plurality of adjustment 3D parameters for improving a fit of the custom product in relation to user-specific data; determining two particular parametric 3D models of the plurality of parametric 3D models, each having at least one 3D parameter, of the plurality of corresponding 3D parameters, that is within a particular tolerance of at least one 3D parameter of the plurality of adjustment 3D parameters; generating a parametric 3D fit model having a plurality of 3D fit model parameters by interpolating, for the at least one parameter of the two particular parametric 3D models, between a plurality of corresponding 3D control points of a first parametric 3D model and a plurality of corresponding 3D control points of a second parametric 3D model of the two particular parametric 3D models; transmitting the parametric 3D fit model to a manufact…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.