Multilayer electronic component
US11735367B2 · kind B2 · utility
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19Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 9, 2021 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Sep 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/2325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the external electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.