Patent · US Active

Faraday cleaning device and plasma processing system

US11735400B2 · kind B2 · utility

0Cited by
1References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 26, 2020
Grant dateAug 22, 2023
Priority date
Expiry dateFeb 26, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/3341
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

Provided are a faraday cleaning device and a plasma processing system, the device comprising a reaction chamber, a bias electrode, a wafer, a chamber cover, a coupling window, an air inlet nozzle, a vertical coil, and a faraday layer, wherein the coupling window is installed at the upper end face of the chamber cover, the chamber cover is installed at the upper end face of the reaction chamber, the bias electrode is assembled inside the reaction chamber, the wafer is installed at the upper end face of the bias electrode, the air inlet nozzle is assembled inside the coupling window, the faraday layer is installed at the upper end face of the coupling window, and the vertical coil is assembled at the upper end face of the faraday layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.