Faraday cleaning device and plasma processing system
US11735400B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2020 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Feb 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3341
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided are a faraday cleaning device and a plasma processing system, the device comprising a reaction chamber, a bias electrode, a wafer, a chamber cover, a coupling window, an air inlet nozzle, a vertical coil, and a faraday layer, wherein the coupling window is installed at the upper end face of the chamber cover, the chamber cover is installed at the upper end face of the reaction chamber, the bias electrode is assembled inside the reaction chamber, the wafer is installed at the upper end face of the bias electrode, the air inlet nozzle is assembled inside the coupling window, the faraday layer is installed at the upper end face of the coupling window, and the vertical coil is assembled at the upper end face of the faraday layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.