Method of demounting thin semiconductor devices
US11735464B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2021 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68395
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The described method enables removal of any flexible material from a temporary carrier for transfer to another surface. In particular, a semiconductor wafer is commonly held by a temporary adhesive to a carrier substrate for support during a variety of processing steps, including thinning of the semiconductor device layer. Subsequent to processing, the described method attaches the ultra-thin device layer to a roll of tape for removal from the temporary adhesive, followed by transfer to a demount roller, which then releases it onto a desired permanent surface. Utilizing the flexible nature of the ultra-thin device layer, the sequence of rollers is able to peel it from the temporary adhesive without any need for laser release processing or chemical adhesive removal while maintaining the thinned wafer in a planar form during processing. This transfer supports operations that include a change of orientation, such as from face up to face down.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.