Patent · US Active

Micro device integration into system substrate

US11735623B2 · kind B2 · utility

0Cited by
24References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 25, 2020
Grant dateAug 22, 2023
Priority date—
Expiry dateJun 25, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/857
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

This disclosure is related to post processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structure such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. In another example, dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with the transferred micro devices. In another example, color conversion layers are integrated into the system substrate to create different output from the micro devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.