Support structure for earpiece cushion
US11736847B2 · kind B2 · utility
1Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2022 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Aug 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R5/0335
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.