In-plane metal microneedle array and manufacturing method therefor
US11738185B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2019 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Feb 21, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H7/02
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An in-plane metal microneedle array and a manufacturing method therefor is disclosed. A large-size metal sheet is cut into small metal sheets. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves matched with the sizes of the small metal sheets. Through holes are formed at edges around the cover plates. The metal sheets are placed in the grooves and fastened through bolts. The geometry and the size of a sheet microneedle array are designed, and a CAD model of the plane microneedles is built. A wire path is cut according to the CAD model. A few materials are reserved on both sides of substrates of the microneedle array without cutting. The unprocessed parts on both sides of the microneedle substrate are cut to obtain an in-plane metal microneedle array with a plurality of microneedle bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.